SLAM-DAST - Smart LightwAve Multi-modal Distributed Acoustic Strain and Temperature sensor (DFM.AD005.339)

Thematic area

Physical sciences and technologies of matter

Project area

Structure responsible for the research project

Institute for microelectronics and microsystems (IMM)

Project manager

GABRIELE BOLOGNINI
Phone number: 0516399101
Email: BOLOGNINI@BO.IMM.CNR.IT

Abstract

Distributed Acoustic Sensing (DAS) and Distributed Temperature-Strain Sensing (DTSS) are two ground-breaking Distributed Fibre Optic Sensor (D-FOS) technologies that allow large-scale measuring and mapping of acoustic vibrations, temperature, mechanical deformations, and pressure in a large variety of consumer-based, civil, industrial, and environmental applications, in particular for attaining the widespread technological nerve system in smart city environments, for instance in smart home/household monitoring (heating, survelliance, fire detection, structural heath, and so forth), as well as in product distribution/logistics (traffic, distribution and plant monitoring).
DAS and DTSS employ a low-priced optical fibre cable installed along the assets (e.g. homes/households in a neighborhood) to be monitored for up to 100 km through an interrogator equipment that sweeps a "virtual sensor" to measure the physical parameters individually at any cable point.

Goals

This project main objective is to develop,
prototype and demonstrate, both in civil/industrial and especially in
household/smart-city case studies, a new, cost-effective, Smart LightwAve
Multi-modal Distributed Acoustic Strain and Temperature photonic sensing system
(SLAM-DAST), which will integrate:
-Distributed Temperature and mechanical deformation (Strain) Sensing (DTSS)
and
-Distributed Acoustic vibrations optical Sensing (DAS)

SLAM-DAST
aims at securing the conditions of a disruptive market exploitation, at an
industrial as well as at a large scale consumer-oriented level, of the project's
results by:
-supporting the product characterisation-standardisation through open access to
performance test benches;
-adopting open innovation policies about general system architecture and embedded
data pre-processing;
-promoting vendor interoperability through the use of open standards and
formats;
- creating shared value through
knowledge-spreading and international networking with key market access
points.

Start date of activity

01/04/2021

Keywords

FOTONICA, SENSORI FIBRA OTTICA, OPTOELETTRONICA

Last update: 24/04/2024