SLAM-DAST - Smart LightwAve Multi-modal Distributed Acoustic Strain and Temperature sensor (DFM.AD005.339)

Area tematica

Scienze fisiche e tecnologie della materia

Area progettuale

Struttura responsabile del progetto di ricerca

Istituto per la microelettronica e microsistemi (IMM)

Responsabile di progetto

GABRIELE BOLOGNINI
Telefono: 0516399101
E-mail: BOLOGNINI@BO.IMM.CNR.IT

Abstract

Distributed Acoustic Sensing (DAS) and Distributed Temperature-Strain Sensing (DTSS) are two ground-breaking Distributed Fibre Optic Sensor (D-FOS) technologies that allow large-scale measuring and mapping of acoustic vibrations, temperature, mechanical deformations, and pressure in a large variety of consumer-based, civil, industrial, and environmental applications, in particular for attaining the widespread technological nerve system in smart city environments, for instance in smart home/household monitoring (heating, survelliance, fire detection, structural heath, and so forth), as well as in product distribution/logistics (traffic, distribution and plant monitoring).
DAS and DTSS employ a low-priced optical fibre cable installed along the assets (e.g. homes/households in a neighborhood) to be monitored for up to 100 km through an interrogator equipment that sweeps a "virtual sensor" to measure the physical parameters individually at any cable point.

Obiettivi

This project main objective is to develop,
prototype and demonstrate, both in civil/industrial and especially in
household/smart-city case studies, a new, cost-effective, Smart LightwAve
Multi-modal Distributed Acoustic Strain and Temperature photonic sensing system
(SLAM-DAST), which will integrate:
-Distributed Temperature and mechanical deformation (Strain) Sensing (DTSS)
and
-Distributed Acoustic vibrations optical Sensing (DAS)

SLAM-DAST
aims at securing the conditions of a disruptive market exploitation, at an
industrial as well as at a large scale consumer-oriented level, of the project's
results by:
-supporting the product characterisation-standardisation through open access to
performance test benches;
-adopting open innovation policies about general system architecture and embedded
data pre-processing;
-promoting vendor interoperability through the use of open standards and
formats;
- creating shared value through
knowledge-spreading and international networking with key market access
points.

Data inizio attività

01/04/2021

Parole chiave

FOTONICA, SENSORI FIBRA OTTICA, OPTOELETTRONICA

Ultimo aggiornamento: 04/05/2024