MUNDFAB - Modeling Unconventional Nanoscaled Device FABrication (DFM.AD006.187)
Area tematica
Scienze fisiche e tecnologie della materia
Area progettuale
Infrastrutture di ricerca , strumentazione avanzata e nuove metodologie sperimentali e di calcolo (DFM.AD006)Struttura responsabile del progetto di ricerca
Istituto per la microelettronica e microsistemi (IMM)
Responsabile di progetto
ANTONINO LAMAGNA
Telefono: 0955968220
E-mail: antonino.lamagna@imm.cnr.it
Abstract
Because of power, energy, and cost reasons, a further development of big data and mobility applications as well as the Internet of Things will require continued Power-Performance-Area-and-Cost (PPAC, formerly More Moore) scaling. This is predicted to lead within less than a decade to a paradigm change towards the 3D sequential integration of nanosized structures. While technology-computer aided design (TCAD) is indispensable now particularly for the early stages of industrial research and development, we face the situation that classical continuum tools lose their predictivity when going towards the nano world and towards the very low temperature processes required for 3D sequential integration. They are then neither able to predict the reduced electrical activation of dopants, nor topography effects like faceting, nor defect formation and growth. Accordingly, the NEREID NanoElectronics Roadmap for Europe explicitly requests to "...develop new tools taking into account all the new materials, technologies and device architectures..." ...
Data inizio attività
01/01/2020
Parole chiave
Technology Computer Aided Design, TCAD, 3D sequential integration
Ultimo aggiornamento: 11/12/2024