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Reduced self-heating in Si/SiGe field-effect transistors on thin virtual substrates prepared by low-energy plasma-enhanced chemical vapor deposition (Articolo in rivista)
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- Reduced self-heating in Si/SiGe field-effect transistors on thin virtual substrates prepared by low-energy plasma-enhanced chemical vapor deposition (Articolo in rivista) (literal)
- Anno
- 2003-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1063/1.1636820 (literal)
- Alternative label
T. Hackbarth(a); H.-J. Herzog(a); K.-H. Hieber(a); U. König(a); M. Bollani(b); D. Chrastina(c); H. von Känel(c); (2003)
Reduced self-heating in Si/SiGe field-effect transistors on thin virtual substrates prepared by low-energy plasma-enhanced chemical vapor deposition
in Applied physics letters; AMER INST PHYSICS, MELVILLE, NY 11747-4501 USA (Stati Uniti d'America)
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- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- T. Hackbarth(a); H.-J. Herzog(a); K.-H. Hieber(a); U. König(a); M. Bollani(b); D. Chrastina(c); H. von Känel(c); (literal)
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- http://scitation.aip.org/content/aip/journal/apl/83/26/10.1063/1.1636820 (literal)
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- a DaimlerChrysler AG, Research and Technology, 89081 Ulm, Germany
b INFM and L-NESS, Dipartimento Scienza dei Materiali, University Milano Bicocca, I-20125 Milano, Italy
c INFM and L-NESS Dipartimento di Fisica, Politecnico di Milano, Polo Regionale di Como, I-22100 Como, Italy (literal)
- Titolo
- Reduced self-heating in Si/SiGe field-effect transistors on thin virtual substrates prepared by low-energy plasma-enhanced chemical vapor deposition (literal)
- Abstract
- This letter reports on the electrical performance of strained Si-based n-type heterostructure field-effect transistors prepared on 500 nm Si0.56Ge0.44 virtual substrates. The method of low-energy plasma-enhanced chemical vapor deposition at low temperature was used for the growth of the relaxed SiGe buffer. The active layers have been deposited by molecular-beam epitaxy. The thin buffer improves the thermal conductivity by a factor of 3 and shows a much lower surface roughness compared to control structures on conventional virtual substrate with a 5-mum-thick graded buffer. Cutoff frequencies of f(T)=55 GHz and f(max)(U)=138 GHz have been achieved which are very close to the results of the control sample. (literal)
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