http://www.cnr.it/ontology/cnr/individuo/prodotto/ID173836
Temperature Dependent Reaction of Thin Ni-Silicide Transrotational Layers on [001]Si (Contributo in atti di convegno)
- Type
- Label
- Temperature Dependent Reaction of Thin Ni-Silicide Transrotational Layers on [001]Si (Contributo in atti di convegno) (literal)
- Anno
- 2007-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1109/RTP.2007.4383835 (literal)
- Alternative label
Alberti A.; Bongiorno C.; Alippi P.; La Magna A.; Spinella C.; Rimini E. (2007)
Temperature Dependent Reaction of Thin Ni-Silicide Transrotational Layers on [001]Si
in 15th International Conference on Advanced Thermal Processing of Semiconductors, 2007 (RTP 2007), Catania, 2-5 Oct. 2007
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- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- Alberti A.; Bongiorno C.; Alippi P.; La Magna A.; Spinella C.; Rimini E. (literal)
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- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#descrizioneSinteticaDelProdotto
- The phase transition from pure Ni to Ni2Si and NiSi was studied by in situ Transmission Electron Microscopy analyses from room temperature to 260 C. The reaction starts at 180 C with the formation of small Ni2Si transrotational domains. Their density and size increase by increasing the annealing temperature to 260 C. After 50 min, a uniform transrotational NiSi layer is formed by a grain by grain transition process. A polycrystalline NiSi layer was instead obtained at 550 C. It was concluded that the final layer structure is the result of a competition: at low temperature (260 C) transrotational domains prevails since slow structural modifications allow the match between silicide and silicon during the Ni2Si - NiSi phase transition; at high temperature (550 C), the growth of randomly oriented silicide grains is favoured. (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- IMM-CNR Catania (literal)
- Titolo
- Temperature Dependent Reaction of Thin Ni-Silicide Transrotational Layers on [001]Si (literal)
- Abstract
- The phase transition from pure Ni to Ni2Si and NiSi was studied by in situ Transmission Electron Microscopy analyses from room temperature to 260 C. The reaction starts at 180 C with the formation of small Ni2Si transrotational domains. Their density and size increase by increasing the annealing temperature to 260 C. After 50 min, a uniform transrotational NiSi layer is formed by a grain by grain transition process. A polycrystalline NiSi layer was instead obtained at 550 C. It was concluded that the final layer structure is the result of a competition: at low temperature (260 C) transrotational domains prevails since slow structural modifications allow the match between silicide and silicon during the Ni2Si - NiSi phase transition; at high temperature (550 C), the growth of randomly oriented silicide grains is favoured. (literal)
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