Consiglio Nazionale delle Ricerche

Tipo di prodottoArticolo in rivista
TitoloDesign and Optimization Techniques of Over-Chip Bondwire MicroTransformers with LTCC core
Anno di pubblicazione2017
Formato
  • Elettronico
  • Cartaceo
Autore/iCamarda A.; Macrelli E.; Paganelli R.P.; Tartagni M.; Roy S.; Romani A.
Affiliazioni autoriAdvanced Research Center on Electronic Systems of the University of Bologna, 47521 Cesena, Italy. Advanced Research Center on Electronic Systems of the University of Bologna, 47521 Cesena, Italy and Dept. of Electrical & Computer Engineering of the National University of Singapore, 117583 SGP. National Research Council CNR-IEIIT, c/o University of Bologna, 40136 Bologna, Italy. Advanced Research Center on Electronic Systems of the University of Bologna, 47521 Cesena, Italy. Micro-Nano Systems Centre of the Tyndall National Institute and Department of Physics, University College Cork, Cork T12 R5CP, Ireland. Advanced Research Center on Electronic Systems of the University of Bologna, 47521 Cesena, Italy.
Autori CNR e affiliazioni
  • RUDI PAOLO PAGANELLI
Lingua/e
  • inglese
AbstractThis paper describes the realization of bond-wire micro-magnetics by using standard bonding-wires and a toroidal ferromagnetic LTCC core with high resistivity. The proposed fabrication procedure is suitable for the development of magnetic components on top of an IC with small profile and small size (< 15 mm2). A transformer is designed and applied over-chip, working in the MHz range with high inductance (~33 ?H) and high effective turns-ratio (~20). Applications include bootstrap circuits and micro-power conversion for energy harvesting. Measurements demonstrate a maximum secondary Q-factor of 11.6 at 1.3 MHz, and a coupling coefficient of 0.65 with an effective turns ratio of 19, which are among the highest values reported for toroidal miniaturized magnetics. The achieved inductance density is 2 ?H/mm2, along with an inductance per unit core volume of 15.6 ?H/mm3, and a DC inductance-to-resistance ratio of 2.23 ?H/?. The presented technique allows to obtain over-chip magnetics trough a post-processing of the core, and it is also suitable for high density power supply in package (PwrSiP) and power supply on chip (PwrSoC). Finally, a series of optimization techniques for planar core magnetic devices in order to maximize the inductance per unit area are discussed and applied to the considered case.
Lingua abstractinglese
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Pagine da-
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Pagine totali12
RivistaIEEE Journal of Emerging and Selected Topics in Power Electronics
ISSN: 2168-6777
Titolo chiave: IEEE Journal of Emerging and Selected Topics in Power Electronics
Numero volume della rivistaPP
Fascicolo della rivista99
DOI10.1109/JESTPE.2017.2751745
Verificato da refereeSì: Internazionale
Stato della pubblicazionePreprint
Indicizzazione (in banche dati controllate)
  • Scopus (Codice:2-s2.0-85030220482)
  • IEEE Xplore digital library (Codice:8036179)
Parole chiavebonding wire, ferrite, harvesting, on-chip, over-chip, low-temperature co-fired ceramics, magnetic transformer, power supply in package, power supply on chip
Link (URL, URI)http://ieeexplore.ieee.org/document/8036179/
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Strutture CNR
  • IEIIT — Istituto di elettronica e di ingegneria dell'informazione e delle telecomunicazioni
Moduli CNR
    Progetti Europei-
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