Consiglio Nazionale delle Ricerche

Tipo di prodottoArticolo in rivista
TitoloModeling, Design, and Fabrication of High Inductance Bond Wire Micro-Transformers with Toroidal Ferrite Core
Anno di pubblicazione2015
Formato
  • Elettronico
  • Cartaceo
Autore/iEnrico Macrelli, Aldo Romani, Ningning Wang, Saibal Roy, Mike Hayes, Rudi Paolo Paganelli, Cian Ó Mathúna, Marco Tartagni
Affiliazioni autoriAdvanced Research Center on Electronic Systems, University of Bologna, Cesena Campus, Cesena I-47521, Italy Advanced Research Center on Electronic Systems, University of Bologna, Cesena Campus, Cesena I-47521, Italy Tyndall National Institute, Cork, Ireland Tyndall National Institute, Cork, Ireland Tyndall National Institute, Cork, Ireland National Research Council CNR-IEIIT, c/o University of Bologna, Bologna I-40136, Italy Tyndall National Institute, Cork, Ireland Advanced Research Center on Electronic Systems, University of Bologna, Cesena Campus, Cesena I-47521, Italy
Autori CNR e affiliazioni
  • RUDI PAOLO PAGANELLI
Lingua/e
  • inglese
AbstractThis paper presents the design of miniaturized bond wire transformers assembled with standard IC bonding wires and NiZn and MnZn ferrite toroidal cores. Several prototypes are fabricated on a PCB substrate with various layouts in a 4.95 mm × 4.95 mm area. The devices are modeled by analytical means and characterized with impedance measurements over a wide frequency range. Experimental results on 1 : 38 device show that the secondary self-inductance increases from 0.3 ?H with air-core to 315 ?H with ferrite core; the coupling coefficient improves from 0.1 with air-core to 0.9 with ferrite core; the effective turns ratio enhances from 0.5 with air-core to 34 with ferrite core. This approach is cost-effective and enables a flexible design of efficient micro-magnetics on-top of ICs with DC inductance to resistance ratio of 70 ?H/? and an inductance per unit area of 12.8 ?H/mm2 up to 0.3 MHz. The design targets the development of bootstrap circuits for ultra-low voltage energy harvesting. In this context, a low voltage step-up oscillator suitable for TEG sources is realized with a commercial IC and the proposed micro-transformers. Experimental measurements on a discrete prototype report that the circuit bootstraps from voltages down to 260 mV and outputs a DC voltage of 2 V
Lingua abstractinglese
Altro abstract-
Lingua altro abstract-
Pagine da5724
Pagine a5737
Pagine totali15
RivistaIEEE transactions on power electronics
Attiva dal 1986
Editore: Institute of Electrical and Electronics Engineers, - New York, NY
Paese di pubblicazione: Stati Uniti d'America
Lingua: inglese
ISSN: 0885-8993
Titolo chiave: IEEE transactions on power electronics
Titolo proprio: IEEE transactions on power electronics.
Titolo abbreviato: IEEE trans. power electron.
Titoli alternativi:
  • Institute of Electrical and Electronics Engineers transactions on power electronics
  • Transactions on power electronics
Numero volume della rivista30
Fascicolo della rivista10
DOI10.1109/TPEL.2014.2370814
Verificato da refereeSì: Internazionale
Stato della pubblicazionePublished version
Indicizzazione (in banche dati controllate)
  • INSPEC (Codice:15144549)
Parole chiaveBonding processes, energy harvesting (EH), ferrite magnetic cores, power supply in package (PwrSiP), power supply on chip (PwrSoC)
Link (URL, URI)http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6955850
Titolo parallelo-
Data di accettazione-
Note/Altre informazioni-
Strutture CNR
  • IEIIT — Istituto di elettronica e di ingegneria dell'informazione e delle telecomunicazioni
Moduli CNR
    Progetti Europei-
    Allegati
    Macrel TPEL MicroFerrite Core (documento privato )
    Tipo documento: application/pdf